MediaTek Expands Flagship Smartphone Performance with the Dimensity 9000+
The company’s latest chipset offers device makers another high-performance option for flagship smartphones
Read MoreThe company’s latest chipset offers device makers another high-performance option for flagship smartphones
Read MoreFilogic 880 and Filogic 380 will drive the next generation of connectivity with the fastest and most reliable Wi-Fi 7 experiences
Read MoreDimensity 1050 mmWave SoC highlights trio of new chipsets expanding MediaTek’s 5G and gaming portfolio
Read MoreMediaTek’s Pentonic series of smart TV chips support advanced new imaging technologies powered by Dolby, including features designed for gaming in Dolby Vision
Read MoreThree new chips expand MediaTek’s Dimensity 5G portfolio
Read MoreNew 6nm SoC brings powerful performance and extra-long battery life to ultra-light Chromebooks
Read MoreMediaTek leads in pervasive wireless connectivity with advanced Filogic Wi-Fi 7 technology
Read MoreBuilt on the leading TSMC N4 process, Dimensity 9000 brings full flagship performance and power-efficiency to smartphones. First MediaTek powered devices will be available in Q1 of 2022
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