HSINCHU, Taiwan – February 16, 2022 – MediaTek MediaTek today announced the Dimensity 7200, its inaugural chipset in the new Dimensity 7000 series. The Dimensity 7200 boasts cutting-edge AI... Read More
Feb 16, 2023 - 9:00 AM
- Products & Technology
-
Investor Relations
-
Financial Information
- Overview
- Monthly Revenue
- Quarterly Earnings Release
- Financial Reports
-
Annual Reports
- Overview
- Overview
- 1. Financial Status
- 2. Operating Results
- 3. Cash Flow Analysis
- 4. Major Capital Expenditure
- 5. Investment Policies
- 6. Risk Management
- 1. Condensed Balance Sheet
- 2. Condensed Statements of Comprehensive Income / Statements of Income
- 3. Auditors’ Opinions from 2012 to 2016
- 4. Five Year Financial Analysis
- 1. Financial Status
- 2. Operating Results
- 3. Cash Flow Analysis
- 4. Major Capital Expenditure
- 5. Investment Policies
- 6. Risk Management
- 1. Condensed Balance Sheet
- 2. Condensed Statements of Comprehensive Income / Statements of Income
- 3. Auditors’ Opinions from 2011 to 2015
- 4. Five-Year Financial Analysis
- 1. Financial Status
- 2. Operating Results
- 3. Cash Flow Analysis
- 4. Major Capital Expenditure
- 5. Investment Policies
- 6. Risk Management
- 1. Condensed Balance Sheets
- 2. Condensed Statements of Comprehensive Income / Statements of Income
- 3. Auditors’ Opinions from 2010 to 2014
- 4. Five-Year Financial Analysis
- 1. Financial Status
- 2. Operating Results
- 3. Cash Flow Analysis
- 4. Major Capital Expenditure
- 5. Investment Policies
- 6. Risk Management
- 1. Condensed Balance Sheets
- 2. Condensed Income Statement
- 3. Independent Auditors’ Opinions
- 4. Financial Statements for the Past 5 Years
-
Financial Information
- MediaTek ESG Highlight
- Dividend History
- Shareholder Services
- FAQ
- Investor News
- Events Calendar
- Contact Investor Relations
- Corporate Governance
- About MediaTek
- Everyday Genius
- Awards & Recognition
- MediaTek Ventures
- MediaTek Foundation
- Office Locations
- Subsidiary Information
-
Careers
- Overview
- Overview
- China
-
Europe
- Overview
- Adamos, Digital Design Verification Intern, Cambourne (Cambridge), UK
- Alex, Communications Software Automation Intern, Cambourne (Cambridge), UK
- Jacob, Communications Software Automation Intern, Cambourne (Cambridge), UK
- Kip, Design Verification Intern, Kent, UK
- Moji, Advanced Digital Communication Systems Modelling intern, Cambourne (Cambridge), UK
- Sisi, Compute Platform Modelling Intern, Cambourne (Cambridge), UK
- Sophie, Communications Software Automation Intern, Cambourne (Cambridge), UK
- India
- Korea
- Singapore
- Taiwan
- United States