Press Room

Team composed of ten engineering students from Spain will work in IOT and Wearable technology solutions. Lab will be hosted by MediaTek Labs in UK and will be supported by MediaTek platforms and technologies. The program will provide guidance and support to the next generation of IoT innovators.

P-series the first to use TSMC’s 28nm HPC+ process, which reduces processor power consumption

The MT7687 combines low power consumption with high performance and security for Smart Home Appliances and other IoT applications

MT7623 and MT7683 feature innovative TRGMII (“Turbo” ethernet interface) to allow bi-directional traffic between WLAN and LAN for a faster connected experience

Innovative three cluster architecture sets new performance and power efficiency benchmarks with up to a 30% reduction in power consumption for the next generation of mobile devices

To ensure robust easy and efficient certification of devices with Pump Express™ Plus

MediaTek LinkIt™ Assist 2502 delivers module-based reference design and feature rich capabilities to software development, prototyping and final hardware design of Wearables

Contest will create Chinese moniker for new MediaTek helio family of 64-bit True 8Core™ LTE products designed to power high-performance devices

MediaTek Cloud Sandbox accelerates device prototyping by offering developers a complimentary cloud service to host prototype-device data

MediaTek Labs Partner Connect provides matchmaking for developers and partners in support of MediaTek LinkIt™